Momentum built for Labelexpo Asia 2023, Asia’s largest label and packaging printing show, which opened its doors at the Shanghai New International Expo Center (SNIEC) from 5-8 December. Celebrating its 20th anniversary, the show hosted over 380 exhibitors at Shanghai’s SNIEC exhibition center.

Visitors to Labelexpo Asia 2023 experienced live demonstrations of new flexo, offset, and digital press technologies, with feature areas focusing on flexible packaging and Radio Frequency Identification (RFID) technology.

A new feature, the Digital Pouch Factory, highlighted short-run flexible packaging. HP Indigo showcased the 25K mid-web digital press alongside Zhoutai AMD350LMSC solventless lamination and bag-making machines. An exclusive event by HP Indigo on 6 December featured an online demonstration of its new HP Indigo 200k mid-web press.

On 4 December, Labelexpo Asia 2023 hosted the International Label Printing Summit with the China Packaging Federation and Label Academy master classes on self-adhesive label technology and sustainability.

RFID took center stage through the Smart Label Trail, providing insights into technology trends and practical applications. A dedicated forum on RFID/smart label innovation explored how RFID technology transformed the supply chain.

Flexo technology returned with suppliers such as Weigang, Spande, and Hongsheng launching new machines. The first Label Industry China Awards, recognizing excellence in the label and package printing sector, took place on the evening of 6 December.

Kevin Liu, China Project Director, Labelexpo Global Series, expressed satisfaction with the 20th-anniversary event, emphasizing the opportunities for networking and knowledge expansion. Jade Grace, Managing Director, Labelexpo Global Series, highlighted the show's significance in showcasing homegrown digital printing technology and advancements in sustainability.